Articles producció científica> Química Analítica i Química Orgànica

Sequential curing of off-stoichiometric thiol-epoxy thermosets with a custom-tailored structure

  • Dades identificatives

    Identificador: PC:1453
    Handle: https://hdl.handle.net/20.500.11797/PC1453
    Autors:
    Silvia De la FlorXavier Fernández-FrancosAli-Osman KonurayAlberto BelmonteÀngels SerraXavier Ramis
    Resum:
    A new dual-curing system based on sequential thiol-epoxy click polycondensation and epoxy anionic homopolymerization was studied. Formulations of diglycidyl ether of bisphenol A and trimethylolpropane tris(3-mercaptopropionate) with 1-methylimidazole as a base catalyst and excess of epoxy groups were prepared and characterized. The curing process is sequential: fast thiol-epoxy polycondensation takes place first, followed by slower homopolymerization of excess epoxy groups. This makes it possible to define curing sequences with easy time-temperature control for both curing stages. The network build-up process during the first curing stage can be easily modelled assuming ideal polycondensation, which allows tailoring the structure and properties of the intermediate materials. The homopolymerization of the excess epoxy groups in the second curing stage results in a higher glass transition temperature (Tg) in comparison with the stoichiometric thiol-epoxy material, thus extending the application of thiol-epoxy thermosets to wider temperature ranges.

  • Altres:

    Autor segons l'article: Silvia De la Flor; Xavier Fernández-Francos; Ali-Osman Konuray; Alberto Belmonte; Àngels Serra; Xavier Ramis
    Departament: Química Analítica i Química Orgànica Enginyeria Mecànica
    Autor/s de la URV: DE LA FLOR LOPEZ, SILVIA; Xavier Fernández-Francos; Ali-Osman Konuray; Alberto Belmonte; SERRA ALBET, MARIA ANGELS; Xavier Ramis
    Resum: A new dual-curing system based on sequential thiol-epoxy click polycondensation and epoxy anionic homopolymerization was studied. Formulations of diglycidyl ether of bisphenol A and trimethylolpropane tris(3-mercaptopropionate) with 1-methylimidazole as a base catalyst and excess of epoxy groups were prepared and characterized. The curing process is sequential: fast thiol-epoxy polycondensation takes place first, followed by slower homopolymerization of excess epoxy groups. This makes it possible to define curing sequences with easy time-temperature control for both curing stages. The network build-up process during the first curing stage can be easily modelled assuming ideal polycondensation, which allows tailoring the structure and properties of the intermediate materials. The homopolymerization of the excess epoxy groups in the second curing stage results in a higher glass transition temperature (Tg) in comparison with the stoichiometric thiol-epoxy material, thus extending the application of thiol-epoxy thermosets to wider temperature ranges.
    Grup de recerca: Grup d'Investigació en Enginyeria Computacional i Experimental Polimers
    Àrees temàtiques: Enginyeria mecànica Ingeniería mecánica Mechanical engineering
    Accès a la llicència d'ús: https://creativecommons.org/licenses/by/3.0/es/
    ISSN: 1759-9954
    Identificador de l'autor: 0000-0002-6851-1371; 0000-0002-3492-2922; n/a; n/a; 0000-0003-1387-0358; 0000-0003-2550-7185
    Data d'alta del registre: 2016-04-14
    Pàgina final: 2290
    Volum de revista: 7
    Versió de l'article dipositat: info:eu-repo/semantics/publishedVersion
    URL Document de llicència: https://repositori.urv.cat/ca/proteccio-de-dades/
    Entitat: Universitat Rovira i Virgili
    Any de publicació de la revista: 2016
    Pàgina inicial: 2280
    Tipus de publicació: Article Artículo Article

  • Paraules clau:

    Epoxy
    Epòxids
    Polymers
    Enginyeria mecànica
    Ingeniería mecánica
    Mechanical engineering
    1759-9954

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