Articles producció científica> Química Analítica i Química Orgànica

Sequential curing of off-stoichiometric thiol-epoxy thermosets with a custom-tailored structure

  • Identification data

    Identifier: PC:1453
    Authors:
    Silvia De la FlorXavier Fernández-FrancosAli-Osman KonurayAlberto BelmonteÀngels SerraXavier Ramis
    Abstract:
    A new dual-curing system based on sequential thiol-epoxy click polycondensation and epoxy anionic homopolymerization was studied. Formulations of diglycidyl ether of bisphenol A and trimethylolpropane tris(3-mercaptopropionate) with 1-methylimidazole as a base catalyst and excess of epoxy groups were prepared and characterized. The curing process is sequential: fast thiol-epoxy polycondensation takes place first, followed by slower homopolymerization of excess epoxy groups. This makes it possible to define curing sequences with easy time-temperature control for both curing stages. The network build-up process during the first curing stage can be easily modelled assuming ideal polycondensation, which allows tailoring the structure and properties of the intermediate materials. The homopolymerization of the excess epoxy groups in the second curing stage results in a higher glass transition temperature (Tg) in comparison with the stoichiometric thiol-epoxy material, thus extending the application of thiol-epoxy thermosets to wider temperature ranges.
  • Others:

    Author, as appears in the article.: Silvia De la Flor; Xavier Fernández-Francos; Ali-Osman Konuray; Alberto Belmonte; Àngels Serra; Xavier Ramis
    Department: Química Analítica i Química Orgànica Enginyeria Mecànica
    URV's Author/s: DE LA FLOR LOPEZ, SILVIA; Xavier Fernández-Francos; Ali-Osman Konuray; Alberto Belmonte; SERRA ALBET, MARIA ANGELS; Xavier Ramis
    Abstract: A new dual-curing system based on sequential thiol-epoxy click polycondensation and epoxy anionic homopolymerization was studied. Formulations of diglycidyl ether of bisphenol A and trimethylolpropane tris(3-mercaptopropionate) with 1-methylimidazole as a base catalyst and excess of epoxy groups were prepared and characterized. The curing process is sequential: fast thiol-epoxy polycondensation takes place first, followed by slower homopolymerization of excess epoxy groups. This makes it possible to define curing sequences with easy time-temperature control for both curing stages. The network build-up process during the first curing stage can be easily modelled assuming ideal polycondensation, which allows tailoring the structure and properties of the intermediate materials. The homopolymerization of the excess epoxy groups in the second curing stage results in a higher glass transition temperature (Tg) in comparison with the stoichiometric thiol-epoxy material, thus extending the application of thiol-epoxy thermosets to wider temperature ranges.
    Research group: Grup d'Investigació en Enginyeria Computacional i Experimental Polimers
    Thematic Areas: Enginyeria mecànica Ingeniería mecánica Mechanical engineering
    licence for use: https://creativecommons.org/licenses/by/3.0/es/
    ISSN: 1759-9954
    Author identifier: 0000-0002-6851-1371; 0000-0002-3492-2922; n/a; n/a; 0000-0003-1387-0358; 0000-0003-2550-7185
    Record's date: 2016-04-14
    Last page: 2290
    Journal volume: 7
    Papper version: info:eu-repo/semantics/publishedVersion
    Link to the original source: https://pubs.rsc.org/en/content/articlelanding/2016/PY/C6PY00099A#!divAbstract
    Licence document URL: https://repositori.urv.cat/ca/proteccio-de-dades/
    Article's DOI: 10.1039/c6py00099a
    Entity: Universitat Rovira i Virgili
    Journal publication year: 2016
    First page: 2280
    Publication Type: Article Artículo Article
  • Keywords:

    Epoxy
    Epòxids
    Polymers
    Enginyeria mecànica
    Ingeniería mecánica
    Mechanical engineering
    1759-9954
  • Documents:

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