Articles producció científica> Química Analítica i Química Orgànica

Thermoconductive Thermosetting Composites Based on Boron Nitride Fillers and Thiol-Epoxy Matrices

  • Identification data

    Identifier: imarina:5132028
  • Authors:

    Isarn I, Ramis X, Ferrando F, Serra A
  • Others:

    Author, as appears in the article.: Isarn I, Ramis X, Ferrando F, Serra A
    Department: Química Analítica i Química Orgànica Enginyeria Mecànica
    e-ISSN: 2073-4360
    URV's Author/s: Ferrando Piera, Francesc / Serra Albet, Maria Angels
    Keywords: Thiol-epoxy Thermal conductivity Epoxy resin Cycloaliphatic epoxy resin Composites Boron nitride thermal conductivity cycloaliphatic epoxy resin composites boron nitride
    Abstract: In this work, the effect of the addition of boron nitride (BN) fillers in a thiol-cycloaliphatic epoxy formulation has been investigated. Calorimetric studies put into evidence that the kinetics of the curing has been scarcely affected and that the addition of particles does not affect the final structure of the network. Rheologic studies have shown the increase in the viscoelastic properties on adding the filler and allow the percolation threshold to be calculated, which was found to be 35.5%. The use of BN agglomerates of bigger size increases notably the viscosity of the formulation. Glass transition temperatures are not affected by the filler added, but Young's modulus and hardness have been notably enhanced. Thermal conductivity of the composites prepared shows a linear increase with the proportion of BN particle sheets added, reaching a maximum of 0.97 W/K·m. The addition of 80 μm agglomerates, allowed to increase this value until 1.75 W/K·m. View Full-Text Keywords: cycloaliphatic epoxy resin; composites; thermal conductivity; boron nitride; thiol-epoxy
    Thematic Areas: Polymers and plastics Polymer science Odontología General chemistry Farmacia Engenharias ii Ciências biológicas ii Chemistry (miscellaneous) Chemistry (all) Biotecnología Astronomia / física
    licence for use: https://creativecommons.org/licenses/by/3.0/es/
    ISSN: 20734360
    Author's mail: angels.serra@urv.cat f.ferrando@urv.cat
    Author identifier: 0000-0003-1387-0358 0000-0003-4450-2734
    Record's date: 2024-09-07
    Journal volume: 10
    Papper version: info:eu-repo/semantics/publishedVersion
    Link to the original source: https://www.mdpi.com/2073-4360/10/3/277
    Licence document URL: https://repositori.urv.cat/ca/proteccio-de-dades/
    Papper original source: Polymers. 10 (3):
    APA: Isarn I, Ramis X, Ferrando F, Serra A (2018). Thermoconductive Thermosetting Composites Based on Boron Nitride Fillers and Thiol-Epoxy Matrices. Polymers, 10(3), -. DOI: 10.3390/polym10030277
    Article's DOI: 10.3390/polym10030277
    Entity: Universitat Rovira i Virgili
    Journal publication year: 2018
    Publication Type: Journal Publications
  • Keywords:

    Chemistry (Miscellaneous),Polymer Science,Polymers and Plastics
    Thiol-epoxy
    Thermal conductivity
    Epoxy resin
    Cycloaliphatic epoxy resin
    Composites
    Boron nitride
    thermal conductivity
    cycloaliphatic epoxy resin
    composites
    boron nitride
    Polymers and plastics
    Polymer science
    Odontología
    General chemistry
    Farmacia
    Engenharias ii
    Ciências biológicas ii
    Chemistry (miscellaneous)
    Chemistry (all)
    Biotecnología
    Astronomia / física
  • Documents:

  • Cerca a google

    Search to google scholar