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Phenomenological characterization of sequential dual-curing of off-stoichiometric “thiol-epoxy” systems: Towards applicability

  • Identification data

    Identifier: imarina:6388878
    Authors:
    Belmonte, AlbertoFernandez-Francos, XavierSerra, AngelsDe la Flor, Silvia
    Abstract:
    © 2016 Elsevier Ltd An extensive characterization of a sequential dual-curing system based on off-stoichiometric “thiol-epoxy” mixtures was carried out using thiol compounds of different functionality. The intermediate and final materials obtained after each curing stages at different thiol-epoxy ratios were studied by means of thermomechanical and rheological experiments. The storage and loss modulus and the loss factor tan δ were monitored during the curing process to analyse gelation and network structure build-up. The critical ratio for gelation was determined making use of the ideal Flory-Stockmayer theory and compared with experimental results. Intermediate materials obtained in the vicinity of the theoretical critical ratio did not have the mechanical consistency expected for partially crosslinked materials, did not retain their shape and even experienced undesired flow upon heating to activate the second curing reaction. The rheological results showed that the critical ratio is higher than the predicted value and that a softening during the second curing stage affects the shape-retention at this ratio. From the thermomechanical results, a wide range of intermediate and final materials with different properties and applicability can be obtained by properly choosing the thiol-epoxy ratio: from liquid-like to highly deformable intermediate materials and from moderately crosslinked (deformable) to highly crosslinked (brittle) final materials.
  • Others:

    Author, as appears in the article.: Belmonte, Alberto; Fernandez-Francos, Xavier; Serra, Angels; De la Flor, Silvia
    Department: Química Analítica i Química Orgànica Enginyeria Mecànica
    URV's Author/s: De la Flor Lopez, Silvia / Fernández Francos, Xavier / Serra Albet, Maria Angels / Serra Masdeu, Anna Isabel Maria
    Keywords: Thiol-epoxy Thermosets Thermo-mechanical analysis Temperature Rheological analysis Polymer Networks Michael addition Mechanical-properties Kinetics Functional materials Dual-curing Differential scanning calorimetry Click reaction Chemistry
    Abstract: © 2016 Elsevier Ltd An extensive characterization of a sequential dual-curing system based on off-stoichiometric “thiol-epoxy” mixtures was carried out using thiol compounds of different functionality. The intermediate and final materials obtained after each curing stages at different thiol-epoxy ratios were studied by means of thermomechanical and rheological experiments. The storage and loss modulus and the loss factor tan δ were monitored during the curing process to analyse gelation and network structure build-up. The critical ratio for gelation was determined making use of the ideal Flory-Stockmayer theory and compared with experimental results. Intermediate materials obtained in the vicinity of the theoretical critical ratio did not have the mechanical consistency expected for partially crosslinked materials, did not retain their shape and even experienced undesired flow upon heating to activate the second curing reaction. The rheological results showed that the critical ratio is higher than the predicted value and that a softening during the second curing stage affects the shape-retention at this ratio. From the thermomechanical results, a wide range of intermediate and final materials with different properties and applicability can be obtained by properly choosing the thiol-epoxy ratio: from liquid-like to highly deformable intermediate materials and from moderately crosslinked (deformable) to highly crosslinked (brittle) final materials.
    Thematic Areas: Química Mechanics of materials Mechanical engineering Materials science, multidisciplinary Materials science (miscellaneous) Materials science (all) Materiais Matemática / probabilidade e estatística Interdisciplinar Geociências General materials science Engenharias iv Engenharias iii Engenharias ii Engenharias i Ciências agrárias i Ciência de alimentos Ciência da computação Astronomia / física Arquitetura e urbanismo
    licence for use: https://creativecommons.org/licenses/by/3.0/es/
    ISSN: 18734197
    Author's mail: angels.serra@urv.cat xavier.fernandez@urv.cat annaisabel.serra@urv.cat silvia.delaflor@urv.cat
    Author identifier: 0000-0003-1387-0358 0000-0002-3492-2922 0000-0001-9353-7154 0000-0002-6851-1371
    Record's date: 2024-11-02
    Papper version: info:eu-repo/semantics/acceptedVersion
    Link to the original source: https://www.sciencedirect.com/science/article/abs/pii/S0264127516313004
    Licence document URL: https://repositori.urv.cat/ca/proteccio-de-dades/
    Papper original source: Materials & Design. 113 116-127
    APA: Belmonte, Alberto; Fernandez-Francos, Xavier; Serra, Angels; De la Flor, Silvia (2017). Phenomenological characterization of sequential dual-curing of off-stoichiometric “thiol-epoxy” systems: Towards applicability. Materials & Design, 113(), 116-127. DOI: 10.1016/j.matdes.2016.10.009
    Article's DOI: 10.1016/j.matdes.2016.10.009
    Entity: Universitat Rovira i Virgili
    Journal publication year: 2017
    Publication Type: Journal Publications
  • Keywords:

    Materials Science (Miscellaneous),Materials Science, Multidisciplinary,Mechanical Engineering,Mechanics of Materials
    Thiol-epoxy
    Thermosets
    Thermo-mechanical analysis
    Temperature
    Rheological analysis
    Polymer
    Networks
    Michael addition
    Mechanical-properties
    Kinetics
    Functional materials
    Dual-curing
    Differential scanning calorimetry
    Click reaction
    Chemistry
    Química
    Mechanics of materials
    Mechanical engineering
    Materials science, multidisciplinary
    Materials science (miscellaneous)
    Materials science (all)
    Materiais
    Matemática / probabilidade e estatística
    Interdisciplinar
    Geociências
    General materials science
    Engenharias iv
    Engenharias iii
    Engenharias ii
    Engenharias i
    Ciências agrárias i
    Ciência de alimentos
    Ciência da computação
    Astronomia / física
    Arquitetura e urbanismo
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