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Novel BN-epoxy/anhydride composites with enhanced thermal conductivity

  • Identification data

    Identifier: imarina:9138944
    Authors:
    Isarn IFerrando FSerra ÀUrbina C
    Abstract:
    © 2020 John Wiley & Sons Ltd A new series of high thermal boron nitride (BN) composites are prepared and characterized by several techniques. They are formed by an epoxy-anhydride matrix and different BN contents, ranging from 30 to 80 wt%, of 120 μm agglomerates. For high BN ratio (≥60 wt%), epoxy mixtures were compressed (75 MPa) during 1 minute before curing, eliminating voids due to the high increase of viscosity, improving the compactness of the material and enhancing the thermal conductivity (TC). The curing process evolution was studied by calorimetric measurements to see if there was an influence of the filler on the curing rate. Rheological tests were performed to obtain the percolation threshold. It was observed that BN filler did not affect negatively the thermomechanical properties of the materials and allowed to enhance the TC from 0.17 W/m K in the case of the neat epoxy, to 3.06 W/m K when 80 wt% of BN agglomerates were added, which represents an improvement of 1700%.
  • Others:

    Author, as appears in the article.: Isarn I; Ferrando F; Serra À; Urbina C
    Department: Enginyeria Mecànica Química Analítica i Química Orgànica
    e-ISSN: 1099-1581
    URV's Author/s: Ferrando Piera, Francesc / Serra Albet, Maria Angels / Urbina Pons, Cristina Victoria
    Keywords: Thermal conductivity Polymer composites Mechanical properties Epoxy resins Boron nitride
    Abstract: © 2020 John Wiley & Sons Ltd A new series of high thermal boron nitride (BN) composites are prepared and characterized by several techniques. They are formed by an epoxy-anhydride matrix and different BN contents, ranging from 30 to 80 wt%, of 120 μm agglomerates. For high BN ratio (≥60 wt%), epoxy mixtures were compressed (75 MPa) during 1 minute before curing, eliminating voids due to the high increase of viscosity, improving the compactness of the material and enhancing the thermal conductivity (TC). The curing process evolution was studied by calorimetric measurements to see if there was an influence of the filler on the curing rate. Rheological tests were performed to obtain the percolation threshold. It was observed that BN filler did not affect negatively the thermomechanical properties of the materials and allowed to enhance the TC from 0.17 W/m K in the case of the neat epoxy, to 3.06 W/m K when 80 wt% of BN agglomerates were added, which represents an improvement of 1700%.
    Thematic Areas: Química Polymers and plastics Polymer science Materiais Interdisciplinar Engenharias ii Ciência de alimentos Biotecnología Astronomia / física
    licence for use: https://creativecommons.org/licenses/by/3.0/es/
    ISSN: 1042-7147
    Author's mail: f.ferrando@urv.cat cristinavictoria.urbina@urv.cat angels.serra@urv.cat
    Author identifier: 0000-0003-4450-2734 0000-0002-4679-7778 0000-0003-1387-0358
    Record's date: 2023-02-19
    Papper version: info:eu-repo/semantics/submittedVersion
    Link to the original source: https://onlinelibrary.wiley.com/doi/abs/10.1002/pat.5184
    Papper original source: Polymers For Advanced Technologies. (4): 1485-1492
    APA: Isarn I; Ferrando F; Serra À; Urbina C (2021). Novel BN-epoxy/anhydride composites with enhanced thermal conductivity. Polymers For Advanced Technologies, (4), 1485-1492. DOI: 10.1002/pat.5184
    Licence document URL: https://repositori.urv.cat/ca/proteccio-de-dades/
    Article's DOI: 10.1002/pat.5184
    Entity: Universitat Rovira i Virgili
    Journal publication year: 2021
    Publication Type: Journal Publications
  • Keywords:

    Polymer Science,Polymers and Plastics
    Thermal conductivity
    Polymer composites
    Mechanical properties
    Epoxy resins
    Boron nitride
    Química
    Polymers and plastics
    Polymer science
    Materiais
    Interdisciplinar
    Engenharias ii
    Ciência de alimentos
    Biotecnología
    Astronomia / física
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