Articles producció científica> Enginyeria Mecànica

PERFORMANCE ANALYSIS OF A MICRO HEAT EXCHANGER IN ELECTRONIC COOLING APPLICATIONS

  • Identification data

    Identifier: imarina:9226198
    Handle: https://hdl.handle.net/20.500.11797/imarina9226198
    Authors:
    Mokrane, MandiLounis, MouradAnnoun, MohamedOuali, MaamarDjebiret, Med AliBourouis, Mahmoud
    Abstract:
    To operate under normal conditions and depending on the technology used, the electronic components must be at a temperature below 80 to 85 degrees C. Several cooling systems were investigated with the aim of improving the heat transfer process in this kind of applications. Single-phase liquid cooling systems, which mainly consist of a hot watercooled micro-heat exchanger, provide an efficient approach to dissipate heat flows. In the present study, numerical and experimental investigations were carried out to study the characteristics of laminar flow and forced convective heat transfer in micro-channels. The inlet temperature of cooling water ranged from 25 to 65 degrees C, the Reynolds number of water flow varied from 250 to 2000, and the electronic power supply component was set at 50, 80 and 120 W. The results showed that the micro heat exchanger was able to dissipate around 70 to 78% of the heat released by the electronic component. As regards the numerical results, it was observed that the inlet water temperature of 55 degrees C kept a heat source up to 80 W for a temperature source below the critical value of 80 degrees C.

  • Others:

    Author, as appears in the article.: Mokrane, Mandi; Lounis, Mourad; Announ, Mohamed; Ouali, Maamar; Djebiret, Med Ali; Bourouis, Mahmoud;
    Department: Enginyeria Mecànica
    URV's Author/s: Bourouis Chebata, Mahmoud
    Keywords: Micro heat exchangers Laminar-flow Cooling of electronic components Cfd
    Abstract: To operate under normal conditions and depending on the technology used, the electronic components must be at a temperature below 80 to 85 degrees C. Several cooling systems were investigated with the aim of improving the heat transfer process in this kind of applications. Single-phase liquid cooling systems, which mainly consist of a hot watercooled micro-heat exchanger, provide an efficient approach to dissipate heat flows. In the present study, numerical and experimental investigations were carried out to study the characteristics of laminar flow and forced convective heat transfer in micro-channels. The inlet temperature of cooling water ranged from 25 to 65 degrees C, the Reynolds number of water flow varied from 250 to 2000, and the electronic power supply component was set at 50, 80 and 120 W. The results showed that the micro heat exchanger was able to dissipate around 70 to 78% of the heat released by the electronic component. As regards the numerical results, it was observed that the inlet water temperature of 55 degrees C kept a heat source up to 80 W for a temperature source below the critical value of 80 degrees C.
    Thematic Areas: Thermodynamics Fluid flow and transfer processes Energy engineering and power technology Building and construction
    licence for use: https://creativecommons.org/licenses/by/3.0/es/
    Author's mail: mahmoud.bourouis@urv.cat
    Author identifier: 0000-0003-2476-5967
    Record's date: 2024-07-27
    Papper version: info:eu-repo/semantics/publishedVersion
    Licence document URL: https://repositori.urv.cat/ca/proteccio-de-dades/
    Papper original source: Journal Of Thermal Engineering. 7 (4): 773-790
    APA: Mokrane, Mandi; Lounis, Mourad; Announ, Mohamed; Ouali, Maamar; Djebiret, Med Ali; Bourouis, Mahmoud; (2021). PERFORMANCE ANALYSIS OF A MICRO HEAT EXCHANGER IN ELECTRONIC COOLING APPLICATIONS. Journal Of Thermal Engineering, 7(4), 773-790. DOI: 10.18186/thermal.929458
    Entity: Universitat Rovira i Virgili
    Journal publication year: 2021
    Publication Type: Journal Publications

  • Keywords:

    Building and Construction,Energy Engineering and Power Technology,Fluid Flow and Transfer Processes,Thermodynamics
    Micro heat exchangers
    Laminar-flow
    Cooling of electronic components
    Cfd
    Thermodynamics
    Fluid flow and transfer processes
    Energy engineering and power technology
    Building and construction

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