Articles producció científica> Química Analítica i Química Orgànica

Sequential curing of off-stoichiometric thiol-epoxy thermosets with a custom-tailored structure

  • Datos identificativos

    Identificador: PC:1453
    Handle: https://hdl.handle.net/20.500.11797/PC1453
    Autores:
    Silvia De la FlorXavier Fernández-FrancosAli-Osman KonurayAlberto BelmonteÀngels SerraXavier Ramis
    Resumen:
    A new dual-curing system based on sequential thiol-epoxy click polycondensation and epoxy anionic homopolymerization was studied. Formulations of diglycidyl ether of bisphenol A and trimethylolpropane tris(3-mercaptopropionate) with 1-methylimidazole as a base catalyst and excess of epoxy groups were prepared and characterized. The curing process is sequential: fast thiol-epoxy polycondensation takes place first, followed by slower homopolymerization of excess epoxy groups. This makes it possible to define curing sequences with easy time-temperature control for both curing stages. The network build-up process during the first curing stage can be easily modelled assuming ideal polycondensation, which allows tailoring the structure and properties of the intermediate materials. The homopolymerization of the excess epoxy groups in the second curing stage results in a higher glass transition temperature (Tg) in comparison with the stoichiometric thiol-epoxy material, thus extending the application of thiol-epoxy thermosets to wider temperature ranges.

  • Otros:

    Autor según el artículo: Silvia De la Flor; Xavier Fernández-Francos; Ali-Osman Konuray; Alberto Belmonte; Àngels Serra; Xavier Ramis
    Departamento: Química Analítica i Química Orgànica Enginyeria Mecànica
    Autor/es de la URV: DE LA FLOR LOPEZ, SILVIA; Xavier Fernández-Francos; Ali-Osman Konuray; Alberto Belmonte; SERRA ALBET, MARIA ANGELS; Xavier Ramis
    Resumen: A new dual-curing system based on sequential thiol-epoxy click polycondensation and epoxy anionic homopolymerization was studied. Formulations of diglycidyl ether of bisphenol A and trimethylolpropane tris(3-mercaptopropionate) with 1-methylimidazole as a base catalyst and excess of epoxy groups were prepared and characterized. The curing process is sequential: fast thiol-epoxy polycondensation takes place first, followed by slower homopolymerization of excess epoxy groups. This makes it possible to define curing sequences with easy time-temperature control for both curing stages. The network build-up process during the first curing stage can be easily modelled assuming ideal polycondensation, which allows tailoring the structure and properties of the intermediate materials. The homopolymerization of the excess epoxy groups in the second curing stage results in a higher glass transition temperature (Tg) in comparison with the stoichiometric thiol-epoxy material, thus extending the application of thiol-epoxy thermosets to wider temperature ranges.
    Grupo de investigación: Grup d'Investigació en Enginyeria Computacional i Experimental Polimers
    Áreas temáticas: Enginyeria mecànica Ingeniería mecánica Mechanical engineering
    Acceso a la licencia de uso: https://creativecommons.org/licenses/by/3.0/es/
    ISSN: 1759-9954
    Identificador del autor: 0000-0002-6851-1371; 0000-0002-3492-2922; n/a; n/a; 0000-0003-1387-0358; 0000-0003-2550-7185
    Fecha de alta del registro: 2016-04-14
    Página final: 2290
    Volumen de revista: 7
    Versión del articulo depositado: info:eu-repo/semantics/publishedVersion
    URL Documento de licencia: https://repositori.urv.cat/ca/proteccio-de-dades/
    Entidad: Universitat Rovira i Virgili
    Año de publicación de la revista: 2016
    Página inicial: 2280
    Tipo de publicación: Article Artículo Article

  • Palabras clave:

    Epoxy
    Epòxids
    Polymers
    Enginyeria mecànica
    Ingeniería mecánica
    Mechanical engineering
    1759-9954

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