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Thermoconductive Thermosetting Composites Based on Boron Nitride Fillers and Thiol-Epoxy Matrices

  • Datos identificativos

    Identificador: imarina:5132028
    Handle: http://hdl.handle.net/20.500.11797/imarina5132028
  • Autores:

    Isarn I, Ramis X, Ferrando F, Serra A
  • Otros:

    Autor según el artículo: Isarn I, Ramis X, Ferrando F, Serra A
    Departamento: Química Analítica i Química Orgànica Enginyeria Mecànica
    e-ISSN: 2073-4360
    Autor/es de la URV: Ferrando Piera, Francesc / Serra Albet, Maria Angels
    Palabras clave: Thiol-epoxy Thermal conductivity Epoxy resin Cycloaliphatic epoxy resin Composites Boron nitride thermal conductivity cycloaliphatic epoxy resin composites boron nitride
    Resumen: In this work, the effect of the addition of boron nitride (BN) fillers in a thiol-cycloaliphatic epoxy formulation has been investigated. Calorimetric studies put into evidence that the kinetics of the curing has been scarcely affected and that the addition of particles does not affect the final structure of the network. Rheologic studies have shown the increase in the viscoelastic properties on adding the filler and allow the percolation threshold to be calculated, which was found to be 35.5%. The use of BN agglomerates of bigger size increases notably the viscosity of the formulation. Glass transition temperatures are not affected by the filler added, but Young's modulus and hardness have been notably enhanced. Thermal conductivity of the composites prepared shows a linear increase with the proportion of BN particle sheets added, reaching a maximum of 0.97 W/K·m. The addition of 80 μm agglomerates, allowed to increase this value until 1.75 W/K·m. View Full-Text Keywords: cycloaliphatic epoxy resin; composites; thermal conductivity; boron nitride; thiol-epoxy
    Áreas temáticas: Polymers and plastics Polymer science Odontología General chemistry Farmacia Engenharias ii Ciências biológicas ii Chemistry (miscellaneous) Chemistry (all) Biotecnología Astronomia / física
    Acceso a la licencia de uso: https://creativecommons.org/licenses/by/3.0/es/
    ISSN: 20734360
    Direcció de correo del autor: f.ferrando@urv.cat angels.serra@urv.cat
    Identificador del autor: 0000-0003-4450-2734 0000-0003-1387-0358
    Fecha de alta del registro: 2023-02-18
    Volumen de revista: 10
    Versión del articulo depositado: info:eu-repo/semantics/publishedVersion
    Enlace a la fuente original: https://www.mdpi.com/2073-4360/10/3/277
    URL Documento de licencia: http://repositori.urv.cat/ca/proteccio-de-dades/
    Referencia al articulo segun fuente origial: Polymers. 10 (3):
    Referencia de l'ítem segons les normes APA: Isarn I, Ramis X, Ferrando F, Serra A (2018). Thermoconductive Thermosetting Composites Based on Boron Nitride Fillers and Thiol-Epoxy Matrices. Polymers, 10(3), -. DOI: 10.3390/polym10030277
    DOI del artículo: 10.3390/polym10030277
    Entidad: Universitat Rovira i Virgili
    Año de publicación de la revista: 2018
    Tipo de publicación: Journal Publications
  • Palabras clave:

    Chemistry (Miscellaneous),Polymer Science,Polymers and Plastics
    Thiol-epoxy
    Thermal conductivity
    Epoxy resin
    Cycloaliphatic epoxy resin
    Composites
    Boron nitride
    thermal conductivity
    cycloaliphatic epoxy resin
    composites
    boron nitride
    Polymers and plastics
    Polymer science
    Odontología
    General chemistry
    Farmacia
    Engenharias ii
    Ciências biológicas ii
    Chemistry (miscellaneous)
    Chemistry (all)
    Biotecnología
    Astronomia / física
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