Autor según el artículo: Azam SA; Fragoso A

Departamento: Enginyeria Química

Autor/es de la URV: Fragoso Sierra, Alex

Palabras clave: Size effect Printed circuit board Modal analysis Fr4 composite Electronic equipment Copper/fr4 composite Copper Circuit

Resumen: © 2020 by the authors. Printed circuit boards constitute the basis of most electronic devices and are mainly fabricated of thin copper films bounded to fiber epoxy laminates, such as FR4. Vibrational stress can induce device failure, and hence, studies addressing their modal properties have important applications. In this paper, cantilever samples made of bare copper bounded to FR4 have been studied to analyze, for the first time, the vibration behavior of specimens with different aspect ratios, with and without central holes of different diameters. Natural frequencies and damping ratios were determined experimentally and analytically using a finite element method for four groups of samples with a very good correspondence between both methods. The fundamental resonance frequency of all the specimens was found to be less than 40 Hz and the influence of a central hole was not significant to affect the modal properties.

Áreas temáticas: Química Process chemistry and technology Physics, applied Materials science, multidisciplinary Materials science (miscellaneous) Materials science (all) Materiais Instrumentation General materials science General engineering Fluid flow and transfer processes Engineering, multidisciplinary Engineering (miscellaneous) Engineering (all) Engenharias ii Engenharias i Computer science applications Ciências biológicas iii Ciências biológicas ii Ciências biológicas i Ciências agrárias i Ciência de alimentos Chemistry, multidisciplinary Biodiversidade Astronomia / física

Acceso a la licencia de uso: https://creativecommons.org/licenses/by/3.0/es/

ISSN: 2076-3417

Direcció de correo del autor: alex.fragoso@urv.cat

Identificador del autor: 0000-0003-4839-6094

Fecha de alta del registro: 2023-02-23

Volumen de revista: 10

Versión del articulo depositado: info:eu-repo/semantics/publishedVersion

Enlace a la fuente original: https://www.mdpi.com/2076-3417/10/15/5197

URL Documento de licencia: http://repositori.urv.cat/ca/proteccio-de-dades/

Referencia al articulo segun fuente origial: Applied Sciences-Basel. 10 (15):

Referencia de l'ítem segons les normes APA: Azam SA; Fragoso A (2020). Experimental and numerical simulation study of the vibration properties of thin copper films bonded to FR4 composite. Applied Sciences-Basel, 10(15), -. DOI: 10.3390/app10155197

DOI del artículo: 10.3390/app10155197

Entidad: Universitat Rovira i Virgili

Año de publicación de la revista: 2020

Tipo de publicación: Journal Publications