Autor según el artículo: Salazar-Concha, Cristian; Ficapal-Cusi, Pilar; Boada-Grau, Joan; Camacho, Luis J.;
Departamento: Psicologia
Autor/es de la URV: Boada Grau, Joan
Palabras clave: Work Technostress Technological stress Scimat Scientific-research Science mapping Personality Outcomes Organizations Information Impact Dark side Consequences Bibliometric indicators Bibliometric analysis
Resumen: This paper analyzes the scientific map of technostress and the scientific production on this topic between 1982 and 2017, highlighting its structure, evolution, and trends in this field. A literature review based on bibliometric analysis of 246 records indexed in Scopus database was conducted. These publications were analyzed according to bibliometric indicators and through science maps with SciMAT. Co-occurrence of terms by grouping techniques was implemented. In addition, elaboration of maps of science and performance analysis for periods was executed. The main contribution of this work is to provide the first scientific map of technostress and a detailed understanding of the scientific production that predicts the directions of future research. The bibliometric analyses permit an overview of the growth, extent and distribution of the scientific literature related to the technostress and the study of the scientific production of an institution, country, author or research group.
Áreas temáticas: Multidisciplinary sciences Multidisciplinary Medicina i Ciências biológicas ii Ciências biológicas i Biotecnología
Acceso a la licencia de uso: https://creativecommons.org/licenses/by/3.0/es/
Direcció de correo del autor: joan.boada@urv.cat
Identificador del autor: 0000-0002-1907-6887
Fecha de alta del registro: 2024-07-27
Versión del articulo depositado: info:eu-repo/semantics/publishedVersion
URL Documento de licencia: https://repositori.urv.cat/ca/proteccio-de-dades/
Referencia al articulo segun fuente origial: Heliyon. 7 (4):
Referencia de l'ítem segons les normes APA: Salazar-Concha, Cristian; Ficapal-Cusi, Pilar; Boada-Grau, Joan; Camacho, Luis J.; (2021). Analyzing the evolution of technostress: A science mapping approach. Heliyon, 7(4), -. DOI: 10.1016/j.heliyon.2021.e06726
Entidad: Universitat Rovira i Virgili
Año de publicación de la revista: 2021
Tipo de publicación: Journal Publications