Articles producció científica> Enginyeria Química

Temperature-Dependent Sheet Resistance and Surface Characterization of Thin Copper Films Bonded to FR4 Composite under Mechanical Vibrations

  • Datos identificativos

    Identificador: imarina:9325992
    Handle: http://hdl.handle.net/20.500.11797/imarina9325992
  • Autores:

    Azam S
    Munshi S
    Hassan MK
    Fragoso A
  • Otros:

    Autor según el artículo: Azam S; Munshi S; Hassan MK; Fragoso A
    Departamento: Enginyeria Química
    Autor/es de la URV: Fragoso Sierra, Alex
    Palabras clave: X-ray diffraction Vibrations Sheet resistance Scanning electron microscope Resistivity Printed-circuit boards Printed circuit board Hydrophilicity Copper/fr4 composite Conductivity x-ray diffraction vibrations sheet resistance scanning electron microscope resistivity printed circuit board hydrophilicity fracture foils fatigue behavior conductivity
    Resumen: Featured Application: Electrical and electronic devices that experience long-term vibrations. Electrical boards, also called printed circuit boards, constitute the basis of most electronic devices. These boards are mainly fabricated of thin copper films bonded to fiber epoxy laminates, such as FR4. Being the most important functional component of these devices, they sometimes undergo mechanical stresses such as shock and vibration during transport and operation that can induce electrical failure and malfunction; hence, studies addressing the effects of vibrations on their electrical properties have important applications. In this paper, small cantilever samples made of bare copper bonded to FR4 with three isolated rectangular zones were studied to analyze, for the first time, variations in electrical properties such as sheet resistance and resistivity before and after 200 k, 500 k, and 800 k vibration cycles at three different temperatures (25, 35, and 45 °C). A significant rise in resistance equivalent to 1657% of the initial value was observed from 0 to 800 k vibration cycles. These changes were accompanied by a 95% decrease in conductivity, from 4.1 × 107 to 2.3 × 106 S/m, whereas very little change in the electrical properties was observed due to temperature rise. Surface analysis by ESEM showed cracks ~1 µm in width and several millimeters in length with a crack density of ~8 cracks per mm after 800 k cycles. The surface composition (100% copper) was not altered even upon a high number of vibration cycles, and static drop contact angle measurements of 117–119 degrees indicated an increase in the hydrophobicity of the surface attributed to increased surface roughness and the accumulation of very small air bubbles on the cracks.
    Áreas temáticas: Química Process chemistry and technology Physics, applied Materials science, multidisciplinary Materials science (miscellaneous) Materials science (all) Materiais Instrumentation General materials science General engineering Fluid flow and transfer processes Engineering, multidisciplinary Engineering (miscellaneous) Engineering (all) Engenharias ii Engenharias i Computer science applications Ciências biológicas iii Ciências biológicas ii Ciências biológicas i Ciências agrárias i Ciência de alimentos Chemistry, multidisciplinary Biodiversidade Astronomia / física
    Acceso a la licencia de uso: https://creativecommons.org/licenses/by/3.0/es/
    Direcció de correo del autor: alex.fragoso@urv.cat
    Identificador del autor: 0000-0003-4839-6094
    Fecha de alta del registro: 2023-08-19
    Versión del articulo depositado: info:eu-repo/semantics/publishedVersion
    Enlace a la fuente original: https://www.mdpi.com/2076-3417/13/13/7941
    Referencia al articulo segun fuente origial: Applied Sciences-Basel. 13 (13):
    Referencia de l'ítem segons les normes APA: Azam S; Munshi S; Hassan MK; Fragoso A (2023). Temperature-Dependent Sheet Resistance and Surface Characterization of Thin Copper Films Bonded to FR4 Composite under Mechanical Vibrations. Applied Sciences-Basel, 13(13), -. DOI: 10.3390/app13137941
    URL Documento de licencia: http://repositori.urv.cat/ca/proteccio-de-dades/
    DOI del artículo: 10.3390/app13137941
    Entidad: Universitat Rovira i Virgili
    Año de publicación de la revista: 2023
    Tipo de publicación: Journal Publications
  • Palabras clave:

    Chemistry, Multidisciplinary,Computer Science Applications,Engineering (Miscellaneous),Engineering, Multidisciplinary,Fluid Flow and Transfer Processes,Instrumentation,Materials Science (Miscellaneous),Materials Science, Multidisciplinary,Physics, Applied,Process Chemistry and Technology
    X-ray diffraction
    Vibrations
    Sheet resistance
    Scanning electron microscope
    Resistivity
    Printed-circuit boards
    Printed circuit board
    Hydrophilicity
    Copper/fr4 composite
    Conductivity
    x-ray diffraction
    vibrations
    sheet resistance
    scanning electron microscope
    resistivity
    printed circuit board
    hydrophilicity
    fracture
    foils
    fatigue behavior
    conductivity
    Química
    Process chemistry and technology
    Physics, applied
    Materials science, multidisciplinary
    Materials science (miscellaneous)
    Materials science (all)
    Materiais
    Instrumentation
    General materials science
    General engineering
    Fluid flow and transfer processes
    Engineering, multidisciplinary
    Engineering (miscellaneous)
    Engineering (all)
    Engenharias ii
    Engenharias i
    Computer science applications
    Ciências biológicas iii
    Ciências biológicas ii
    Ciências biológicas i
    Ciências agrárias i
    Ciência de alimentos
    Chemistry, multidisciplinary
    Biodiversidade
    Astronomia / física
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