Computational and experimental modeling of fluid flow and heat transfer processes in complex geometries

Identifier:  TDX:1055

Handle: https://hdl.handle.net/20.500.11797/TDX1055

Authors:  Varela Ballesta, Sylvana Verónica

Abstract:
The main objective of this work is the numerical (caffa3d.MB) and experimental (PIV) study of the velocity and temperature fields in complex domains like those encountered in computers or other electronic refrigerated systems with printed circuit board (PCB). Cooling is one of the main challenges these devices have to deal with. Heat removal from the electronic circuit devices has become an important issue to take into account during their design. PCB's are electronic circuits that generate heat by Joule effect and need to be cooled down. They are becoming smaller and therefore some warming problems appear that lowers their efficiency and lifespan. The study of the velocity and temperature fields is closely connected with the analysis of the spatial and temporal evolution of the flow structures found in PCB enclosed cavities and with the understanding of the influence of the geometry, the inlet fluid velocity and plate temperature in the cooling process of the PCB.