Articles producció científica> Enginyeria Electrònica, Elèctrica i Automàtica

The 2021 flexible and printed electronics roadmap

  • Identification data

    Identifier: imarina:9219131
  • Authors:

    Bonnassieux Y
    Brabec CJ
    Cao Y
    Carmichael TB
    Chabinyc ML
    Cheng KT
    Cho G
    Chung A
    Cobb CL
    Distler A
    Egelhaaf HJ
    Grau G
    Guo X
    Haghiashtiani G
    Huang TC
    Hussain MM
    Iniguez B
    Lee TM
    Li L
    Ma Y
    Ma D
    McAlpine MC
    Ng TN
    Österbacka R
    Patel SN
    Peng J
    Peng H
    Rivnay J
    Shao L
    Steingart D
    Street RA
    Subramanian V
    Torsi L
    Wu Y
  • Others:

    Author, as appears in the article.: Bonnassieux Y; Brabec CJ; Cao Y; Carmichael TB; Chabinyc ML; Cheng KT; Cho G; Chung A; Cobb CL; Distler A; Egelhaaf HJ; Grau G; Guo X; Haghiashtiani G; Huang TC; Hussain MM; Iniguez B; Lee TM; Li L; Ma Y; Ma D; McAlpine MC; Ng TN; Österbacka R; Patel SN; Peng J; Peng H; Rivnay J; Shao L; Steingart D; Street RA; Subramanian V; Torsi L; Wu Y
    Department: Enginyeria Electrònica, Elèctrica i Automàtica
    URV's Author/s: Iñiguez Nicolau, Benjamin
    Keywords: Thin film transistors Sensors Roll-to-roll printing Organic photovoltaics Organic light emitting diodes Flexible and printed electronics E-textiles
    Abstract: This roadmap includes the perspectives and visions of leading researchers in the key areas of flexible and printable electronics. The covered topics are broadly organized by the device technologies (sections 1–9), fabrication techniques (sections 10–12), and design and modeling approaches (sections 13 and 14) essential to the future development of new applications leveraging flexible electronics (FE). The interdisciplinary nature of this field involves everything from fundamental scientific discoveries to engineering challenges; from design and synthesis of new materials via novel device design to modelling and digital manufacturing of integrated systems. As such, this roadmap aims to serve as a resource on the current status and future challenges in the areas covered by the roadmap and to highlight the breadth and wide-ranging opportunities made available by FE technologies.
    Thematic Areas: Materials science, multidisciplinary Materiais Electronic, optical and magnetic materials Electrical and electronic engineering Ciencias sociales
    licence for use: https://creativecommons.org/licenses/by/3.0/es/
    Author's mail: benjamin.iniguez@urv.cat
    Author identifier: 0000-0002-6504-7980
    Record's date: 2024-07-27
    Journal volume: 6
    Papper version: info:eu-repo/semantics/publishedVersion
    Link to the original source: https://iopscience.iop.org/article/10.1088/2058-8585/abf986
    Licence document URL: https://repositori.urv.cat/ca/proteccio-de-dades/
    Papper original source: Flexible And Printed Electronics. 6 (2):
    APA: Bonnassieux Y; Brabec CJ; Cao Y; Carmichael TB; Chabinyc ML; Cheng KT; Cho G; Chung A; Cobb CL; Distler A; Egelhaaf HJ; Grau G; Guo X; Haghiashtiani G (2021). The 2021 flexible and printed electronics roadmap. Flexible And Printed Electronics, 6(2), -. DOI: 10.1088/2058-8585/abf986
    Article's DOI: 10.1088/2058-8585/abf986
    Entity: Universitat Rovira i Virgili
    Journal publication year: 2021
    Publication Type: Journal Publications
  • Keywords:

    Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials,Materials Science, Multidisciplinary
    Thin film transistors
    Sensors
    Roll-to-roll printing
    Organic photovoltaics
    Organic light emitting diodes
    Flexible and printed electronics
    E-textiles
    Materials science, multidisciplinary
    Materiais
    Electronic, optical and magnetic materials
    Electrical and electronic engineering
    Ciencias sociales
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