Author, as appears in the article.: Bonnassieux Y; Brabec CJ; Cao Y; Carmichael TB; Chabinyc ML; Cheng KT; Cho G; Chung A; Cobb CL; Distler A; Egelhaaf HJ; Grau G; Guo X; Haghiashtiani G; Huang TC; Hussain MM; Iniguez B; Lee TM; Li L; Ma Y; Ma D; McAlpine MC; Ng TN; Österbacka R; Patel SN; Peng J; Peng H; Rivnay J; Shao L; Steingart D; Street RA; Subramanian V; Torsi L; Wu Y
Department: Enginyeria Electrònica, Elèctrica i Automàtica
URV's Author/s: Iñiguez Nicolau, Benjamin
Keywords: Thin film transistors Sensors Roll-to-roll printing Organic photovoltaics Organic light emitting diodes Flexible and printed electronics E-textiles
Abstract: This roadmap includes the perspectives and visions of leading researchers in the key areas of flexible and printable electronics. The covered topics are broadly organized by the device technologies (sections 1–9), fabrication techniques (sections 10–12), and design and modeling approaches (sections 13 and 14) essential to the future development of new applications leveraging flexible electronics (FE). The interdisciplinary nature of this field involves everything from fundamental scientific discoveries to engineering challenges; from design and synthesis of new materials via novel device design to modelling and digital manufacturing of integrated systems. As such, this roadmap aims to serve as a resource on the current status and future challenges in the areas covered by the roadmap and to highlight the breadth and wide-ranging opportunities made available by FE technologies.
Thematic Areas: Materials science, multidisciplinary Materiais Electronic, optical and magnetic materials Electrical and electronic engineering Ciencias sociales
licence for use: https://creativecommons.org/licenses/by/3.0/es/
Author's mail: benjamin.iniguez@urv.cat
Author identifier: 0000-0002-6504-7980
Record's date: 2024-07-27
Journal volume: 6
Papper version: info:eu-repo/semantics/publishedVersion
Licence document URL: https://repositori.urv.cat/ca/proteccio-de-dades/
Papper original source: Flexible And Printed Electronics. 6 (2):
APA: Bonnassieux Y; Brabec CJ; Cao Y; Carmichael TB; Chabinyc ML; Cheng KT; Cho G; Chung A; Cobb CL; Distler A; Egelhaaf HJ; Grau G; Guo X; Haghiashtiani G (2021). The 2021 flexible and printed electronics roadmap. Flexible And Printed Electronics, 6(2), -. DOI: 10.1088/2058-8585/abf986
Entity: Universitat Rovira i Virgili
Journal publication year: 2021
Publication Type: Journal Publications