Nuevos procesos de curado click con tioles y su aplicación a la preparación de materiales basados en eugenol

Identificador:  TDX:2682

Handle: https://hdl.handle.net/20.500.11797/TDX2682

Autors:  Guzmán Meneses, Dailyn

Resum:
Nowadays, the world consumption of thermosetting materials is very high. Among the resins of greatest demand there is the diglycidyl ether of bisphenol A. This epoxy resin is obtained from fuel derivatives. Today, however, there is a need to implement greener technologies and methodologies with low environmental impact. In this sense, the objective of this work has been the preparation of new thermosets from renewable sources, such as eugenol, which in addition to present a very versatile chemical structure, has a very low cost, due to its great natural abundance and easy extraction from the clove. Different eugenol derivatives have been synthesized and subsequently used as starting monomers in the preparation of different thermosets. The curing of these materials has been carried out by click reactions, which are environmentally friendly, are characterized by being selective and do not require the use of solvents among many other advantages. The curing process by thiol-click reactions can be photochemical or thermal or a combination of both. In this work the curing was carried out using thiol-epoxy, thiol-ene reactions and dual curing involving both reactions. Using latent catalysts high stability was achieved at the beginning of both curing steps. In addition to the allyl, glycidyl and thiol derivatives derived from eugenol, a thiol derived from squalene, as well as other commercial epoxy and thiol resins were employed. The thermosets obtained by curing by thiol-click reactions proved to have a high thermal stability and transparency. The thermal and mechanical properties of the materials depended on the monomers employed, the composition and the cured process. Thermosets prepared from eugenol and biseugenol showed better properties when thiol-epoxy reactions were used in the curing process.