Electrical Properties and Surface Characterization of Thin Copper Films Subjected to Mechanical Vibrations

Identifier:  TDX:3375

Handle: https://hdl.handle.net/20.500.11797/TDX3375

Authors:  Azam, Sufyan

Abstract:
Mechanical and electrical characteristics of thin copper films bonded to FR4 epoxy laminates, under thermal and mechanical loading, were studied. At the 1st stage modal parameters such as Natural frequencies and damping ratios were determined experimentally and analytically using a finite element method for four groups of samples, in order to study the geometric effects and the presence of a central hole of different diameters. It has been found that these sizes are suitable to be used as electronic circuit boards that undergo significant frequency changes ranging from 40 Hz to 1 kHz. The fundamental resonance frequency of all the specimens was found to be less than 40 Hz and the influence of a central hole was not significant to affect the modal properties. During the second stage of the accomplished research, the effect of high frequency vibrations on the electrical properties were determined. It was found experimentally that the stresses induced in the thin films due to high frequency and number of cycles significantly affect material sheet resistance and other electrical properties such as resistivity and conductivity. These mechanical loadings ultimately reduces electrical performance of thin copper films (PCBs). SEM images showed formation of cracks near the high stress zone; these cracks later propagates the failure of the equipment. The surface temperature change from 25ºC to 45ºC showed a little change in sheet resistance of thin copper films. This thesis has thus been a contribution to a better understanding of the relationship between damage accumulation and electrical performance of PCB boards and MEMS and may lead to improvements of their fabrication. This makes the results of great practical importance and the developed assay methodology can be extended to other thin films.