Identifier: TDX:807
Authors: González Búrdalo, Lidia
Abstract:
Thermosetting polymers are interesting materials widely versatilities in the electronics industry because of their good characteristics. The present work is included in this field and it is focused in obtaining new epoxydic thermosets that may be useful as coatings for electronic devices. The objectives posed in this work were to obtain materials that: 1) undergo low shrinkage during curing process, 2) allow to be thermally degraded in a controlled way once their service life is over and 3) improve the mechanical properties with respect to the conventional epoxy materials. The shrinkage of the polymeric network during curing process produces internal mechanical stress and consequently it can lead to the appearance of microvoids and microcracks. Spiroorthoesters (SOEs) are considered to be expandable monomers, which experience expansion during polymerization process. SOEs can be synthesized by reaction of epoxides with lactones in the presence of a Lewis acid as catalyst. The expansion in volume of these monomers is due to the ring-opening polymerization process. It produces a change in atomic distances from the cyclic form (covalent distance) to the open one (Van der Waals distance). The copolymerization of epoxy resins with lactones in the presence of a Lewis acid leads to 'in situ' formation of spiroorthoesters. Once it is formed, it polymerizes yielding poly(ether-ester) unities into the three-dimensional network. On polymerizing expansion is produced, just when the material has no mobility and therefore avoiding internal stress. The typical structure of a thermoset implies that once it is applied over an electronic device neither solvents nor heat can remove it. The introduction of ester groups into the network, especially if are tertiary, allows diminishing the temperature of thermal degradation in comparison to that of conventional epoxy materials. When these new materials are subjected to a thermal process, the thermoset network undergoes a partial degradation. This is enough to remove it by dissolution or mechanical friction. Therefore, the electronic device can be repaired or recycled. Finally, the introduction of aliphatic moieties into the thermoset network reduces the cross-linking density and the fragility of materials, giving more flexibility to the material. In the present work, a commercial epoxy resin, diglycidyl ether of bisphenol A (DGEBA) was used. As lactones 2,2-dimethyl-4,6-dioxo-1,3-dioxane or Meldrum acid (MA) and three of its derivatives with the five position disubstituted. The structure of these compounds allows incorporating tertiary ester groups and aliphatic chains into the epoxydic network. A new epoxy resin was synthesized: 5,5-bis(diglycidyl)-2,2-dimethyl-4,6-dioxo-1,3-dioxane (DGMA), which present both a bislactone ring and glicydilyc groups. This resin was homopolymerized and copolymerized with the epoxy resin of diglycidyl ether of bisphenol A. As Lewis acids triflates of rare earths were studied. These allow curing in atmospheric conditions. The materials obtained with triflates of rare earths were compared to the materials obtained with boron trifluoride complex, which is a conventional cationic initiator. Furthermore, materials from the same monomers were obtained by using an anionic initiator. In this case, the curing mechanism does not imply the generation of spiroorthoester groups, but equally it leads to networks with a poly (ether-ester) structure. The followed steps in the present work are:1. Synthesis and structural characterization of Meldrum acid derivatives. 2. Study of the mechanism of cationic and anionic copolymerization reactions of the epoxy resin with Meldrum acid and its derivatives using lanthanide triflats, BF3·MEA and DMAP, by differential scanning calorimetry and FTIR-ATR. 3. The kinetics of the curing process was studied by differential scanning calorimetry.4. Structural characterization of the materials obtained.5. Evaluation of the thermal and mechanical properties of materials and the degree of shrinkage experimented in the curing. 6. Study of the degradation process of thermosetting materials obtained and the conditions in which it is produced. From the study carried out it can be concluded that a global reduction in the shrinkage on curing was achieved. Also, materials that start the degradation at lower temperatures than conventional epoxy resins were obtained. These materials come to be more flexible
Repositori URV