Repositori URV

Identificador: TDX:1030

Handle: https://hdl.handle.net/20.500.11797/TDX1030

Autores:
Morell Bel, Mireia

Resumen:
This work is related to the field of thermosetting materials as coatings or encapsulates for microelectronic devices. The main objective of this project deals with the improvement of durability of a commercial epoxy resin (diglycidylether of bisphenol A, DGEBA) and its capability to be degraded after its working life which let the recuperation of the electronic material, which fulfills the environmental requirements. The approach selected has been the modification of DGEBA by means of dendritic polymer structures such as hyperbranched and multiarm star polymers. This strategy leads to introduce ester groups into the epoxy network which are thermally labile and the reduction of the shrinkage during the curing process. In addition, the free of the epoxy network is increased by the incorporation of these kinds of macromolecular structures which helps increasing toughness without worsening the processability of the reactive formulation and the thermomechanical properties of the resulting thermoset.