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Novel BN-epoxy/anhydride composites with enhanced thermal conductivity

  • Dades identificatives

    Identificador: imarina:9138944
    Autors:
    Isarn IFerrando FSerra ÀUrbina C
    Resum:
    © 2020 John Wiley & Sons Ltd A new series of high thermal boron nitride (BN) composites are prepared and characterized by several techniques. They are formed by an epoxy-anhydride matrix and different BN contents, ranging from 30 to 80 wt%, of 120 μm agglomerates. For high BN ratio (≥60 wt%), epoxy mixtures were compressed (75 MPa) during 1 minute before curing, eliminating voids due to the high increase of viscosity, improving the compactness of the material and enhancing the thermal conductivity (TC). The curing process evolution was studied by calorimetric measurements to see if there was an influence of the filler on the curing rate. Rheological tests were performed to obtain the percolation threshold. It was observed that BN filler did not affect negatively the thermomechanical properties of the materials and allowed to enhance the TC from 0.17 W/m K in the case of the neat epoxy, to 3.06 W/m K when 80 wt% of BN agglomerates were added, which represents an improvement of 1700%.
  • Altres:

    Autor segons l'article: Isarn I; Ferrando F; Serra À; Urbina C
    Departament: Enginyeria Mecànica Química Analítica i Química Orgànica
    e-ISSN: 1099-1581
    Autor/s de la URV: Ferrando Piera, Francesc / Serra Albet, Maria Angels / Urbina Pons, Cristina Victoria
    Paraules clau: Thermal conductivity Polymer composites Mechanical properties Epoxy resins Boron nitride
    Resum: © 2020 John Wiley & Sons Ltd A new series of high thermal boron nitride (BN) composites are prepared and characterized by several techniques. They are formed by an epoxy-anhydride matrix and different BN contents, ranging from 30 to 80 wt%, of 120 μm agglomerates. For high BN ratio (≥60 wt%), epoxy mixtures were compressed (75 MPa) during 1 minute before curing, eliminating voids due to the high increase of viscosity, improving the compactness of the material and enhancing the thermal conductivity (TC). The curing process evolution was studied by calorimetric measurements to see if there was an influence of the filler on the curing rate. Rheological tests were performed to obtain the percolation threshold. It was observed that BN filler did not affect negatively the thermomechanical properties of the materials and allowed to enhance the TC from 0.17 W/m K in the case of the neat epoxy, to 3.06 W/m K when 80 wt% of BN agglomerates were added, which represents an improvement of 1700%.
    Àrees temàtiques: Química Polymers and plastics Polymer science Materiais Interdisciplinar Engenharias ii Ciência de alimentos Biotecnología Astronomia / física
    Accès a la llicència d'ús: https://creativecommons.org/licenses/by/3.0/es/
    ISSN: 1042-7147
    Adreça de correu electrònic de l'autor: f.ferrando@urv.cat cristinavictoria.urbina@urv.cat angels.serra@urv.cat
    Identificador de l'autor: 0000-0003-4450-2734 0000-0002-4679-7778 0000-0003-1387-0358
    Data d'alta del registre: 2023-02-19
    Versió de l'article dipositat: info:eu-repo/semantics/submittedVersion
    Enllaç font original: https://onlinelibrary.wiley.com/doi/abs/10.1002/pat.5184
    Referència a l'article segons font original: Polymers For Advanced Technologies. (4): 1485-1492
    Referència de l'ítem segons les normes APA: Isarn I; Ferrando F; Serra À; Urbina C (2021). Novel BN-epoxy/anhydride composites with enhanced thermal conductivity. Polymers For Advanced Technologies, (4), 1485-1492. DOI: 10.1002/pat.5184
    URL Document de llicència: https://repositori.urv.cat/ca/proteccio-de-dades/
    DOI de l'article: 10.1002/pat.5184
    Entitat: Universitat Rovira i Virgili
    Any de publicació de la revista: 2021
    Tipus de publicació: Journal Publications
  • Paraules clau:

    Polymer Science,Polymers and Plastics
    Thermal conductivity
    Polymer composites
    Mechanical properties
    Epoxy resins
    Boron nitride
    Química
    Polymers and plastics
    Polymer science
    Materiais
    Interdisciplinar
    Engenharias ii
    Ciência de alimentos
    Biotecnología
    Astronomia / física
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