Autor segons l'article: Salazar-Concha, Cristian; Ficapal-Cusi, Pilar; Boada-Grau, Joan; Camacho, Luis J.;
Departament: Psicologia
Autor/s de la URV: Boada Grau, Joan
Paraules clau: Work Technostress Technological stress Scimat Scientific-research Science mapping Personality Outcomes Organizations Information Impact Dark side Consequences Bibliometric indicators Bibliometric analysis
Resum: This paper analyzes the scientific map of technostress and the scientific production on this topic between 1982 and 2017, highlighting its structure, evolution, and trends in this field. A literature review based on bibliometric analysis of 246 records indexed in Scopus database was conducted. These publications were analyzed according to bibliometric indicators and through science maps with SciMAT. Co-occurrence of terms by grouping techniques was implemented. In addition, elaboration of maps of science and performance analysis for periods was executed. The main contribution of this work is to provide the first scientific map of technostress and a detailed understanding of the scientific production that predicts the directions of future research. The bibliometric analyses permit an overview of the growth, extent and distribution of the scientific literature related to the technostress and the study of the scientific production of an institution, country, author or research group.
Àrees temàtiques: Multidisciplinary sciences Multidisciplinary Medicina i Ciências biológicas ii Ciências biológicas i Biotecnología
Accès a la llicència d'ús: https://creativecommons.org/licenses/by/3.0/es/
Adreça de correu electrònic de l'autor: joan.boada@urv.cat
Identificador de l'autor: 0000-0002-1907-6887
Data d'alta del registre: 2024-07-27
Versió de l'article dipositat: info:eu-repo/semantics/publishedVersion
URL Document de llicència: https://repositori.urv.cat/ca/proteccio-de-dades/
Referència a l'article segons font original: Heliyon. 7 (4):
Referència de l'ítem segons les normes APA: Salazar-Concha, Cristian; Ficapal-Cusi, Pilar; Boada-Grau, Joan; Camacho, Luis J.; (2021). Analyzing the evolution of technostress: A science mapping approach. Heliyon, 7(4), -. DOI: 10.1016/j.heliyon.2021.e06726
Entitat: Universitat Rovira i Virgili
Any de publicació de la revista: 2021
Tipus de publicació: Journal Publications
Repositori URV