Tesis doctorals> Departament d'Enginyeria Mecànica

Computational and experimental modeling of fluid flow and heat transfer processes in complex geometries

  • Dades identificatives

    Identificador: TDX:1055
    Autors:
    Varela Ballesta, Sylvana Verónica
    Resum:
    The main objective of this work is the numerical (caffa3d.MB) and experimental (PIV) study of the velocity and temperature fields in complex domains like those encountered in computers or other electronic refrigerated systems with printed circuit board (PCB). Cooling is one of the main challenges these devices have to deal with. Heat removal from the electronic circuit devices has become an important issue to take into account during their design. PCB's are electronic circuits that generate heat by Joule effect and need to be cooled down. They are becoming smaller and therefore some warming problems appear that lowers their efficiency and lifespan. The study of the velocity and temperature fields is closely connected with the analysis of the spatial and temporal evolution of the flow structures found in PCB enclosed cavities and with the understanding of the influence of the geometry, the inlet fluid velocity and plate temperature in the cooling process of the PCB.
  • Altres:

    Data: 2012-04-17
    Departament/Institut: Departament d'Enginyeria Mecànica Universitat Rovira i Virgili.
    Idioma: eng
    Identificador: http://hdl.handle.net/10803/80717
    Font: TDX (Tesis Doctorals en Xarxa)
    Autor: Varela Ballesta, Sylvana Verónica
    Director: Vernet Peña, Anton Ferré, Josep Anton
    Format: application/pdf 132 p.
    Editor: Universitat Rovira i Virgili
    Paraula Clau: Transferencia de calor Simulación numérica Cavidades con circuitos integrados Particle Image Velocimetry
    Títol: Computational and experimental modeling of fluid flow and heat transfer processes in complex geometries
    Matèria: 62 - Enginyeria. Tecnologia 536 - Calor. Termodinàmica 53 - Física
  • Paraules clau:

    62 - Enginyeria. Tecnologia
    536 - Calor. Termodinàmica
    53 - Física
  • Documents:

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