Autor segons l'article: Azam, Sufyan A; Fragoso, Alex
Departament: Enginyeria Química
Autor/s de la URV: Fragoso Sierra, Alex
Paraules clau: Size effect Printed circuit board Modal analysis Fr4 composite Electronic equipment Copper/fr4 composite Copper Circuit
Resum: © 2020 by the authors. Printed circuit boards constitute the basis of most electronic devices and are mainly fabricated of thin copper films bounded to fiber epoxy laminates, such as FR4. Vibrational stress can induce device failure, and hence, studies addressing their modal properties have important applications. In this paper, cantilever samples made of bare copper bounded to FR4 have been studied to analyze, for the first time, the vibration behavior of specimens with different aspect ratios, with and without central holes of different diameters. Natural frequencies and damping ratios were determined experimentally and analytically using a finite element method for four groups of samples with a very good correspondence between both methods. The fundamental resonance frequency of all the specimens was found to be less than 40 Hz and the influence of a central hole was not significant to affect the modal properties.
Àrees temàtiques: Química Process chemistry and technology Physics, applied Materials science, multidisciplinary Materials science (miscellaneous) Materials science (all) Materiais Instrumentation General materials science General engineering Fluid flow and transfer processes Engineering, multidisciplinary Engineering (miscellaneous) Engineering (all) Engenharias ii Engenharias i Computer science applications Ciências biológicas iii Ciências biológicas ii Ciências biológicas i Ciências agrárias i Ciência de alimentos Chemistry, multidisciplinary Biodiversidade Astronomia / física
Accès a la llicència d'ús: https://creativecommons.org/licenses/by/3.0/es/
ISSN: 2076-3417
Adreça de correu electrònic de l'autor: alex.fragoso@urv.cat
Identificador de l'autor: 0000-0003-4839-6094
Data d'alta del registre: 2024-10-12
Volum de revista: 10
Versió de l'article dipositat: info:eu-repo/semantics/publishedVersion
Enllaç font original: https://www.mdpi.com/2076-3417/10/15/5197
URL Document de llicència: https://repositori.urv.cat/ca/proteccio-de-dades/
Referència a l'article segons font original: Applied Sciences-Basel. 10 (15): 5197-
Referència de l'ítem segons les normes APA: Azam, Sufyan A; Fragoso, Alex (2020). Experimental and numerical simulation study of the vibration properties of thin copper films bonded to FR4 composite. Applied Sciences-Basel, 10(15), 5197-. DOI: 10.3390/app10155197
DOI de l'article: 10.3390/app10155197
Entitat: Universitat Rovira i Virgili
Any de publicació de la revista: 2020
Tipus de publicació: Journal Publications
Repositori URV