Author, as appears in the article.: Azam SA; Fragoso A
Department: Enginyeria Química
URV's Author/s: Fragoso Sierra, Alex
Keywords: Size effect Printed circuit board Modal analysis Fr4 composite Electronic equipment Copper/fr4 composite Copper Circuit
Abstract: © 2020 by the authors. Printed circuit boards constitute the basis of most electronic devices and are mainly fabricated of thin copper films bounded to fiber epoxy laminates, such as FR4. Vibrational stress can induce device failure, and hence, studies addressing their modal properties have important applications. In this paper, cantilever samples made of bare copper bounded to FR4 have been studied to analyze, for the first time, the vibration behavior of specimens with different aspect ratios, with and without central holes of different diameters. Natural frequencies and damping ratios were determined experimentally and analytically using a finite element method for four groups of samples with a very good correspondence between both methods. The fundamental resonance frequency of all the specimens was found to be less than 40 Hz and the influence of a central hole was not significant to affect the modal properties.
Thematic Areas: Química Process chemistry and technology Physics, applied Materials science, multidisciplinary Materials science (miscellaneous) Materials science (all) Materiais Instrumentation General materials science General engineering Fluid flow and transfer processes Engineering, multidisciplinary Engineering (miscellaneous) Engineering (all) Engenharias ii Engenharias i Computer science applications Ciências biológicas iii Ciências biológicas ii Ciências biológicas i Ciências agrárias i Ciência de alimentos Chemistry, multidisciplinary Biodiversidade Astronomia / física
licence for use: https://creativecommons.org/licenses/by/3.0/es/
ISSN: 2076-3417
Author's mail: alex.fragoso@urv.cat
Author identifier: 0000-0003-4839-6094
Record's date: 2023-12-16
Journal volume: 10
Papper version: info:eu-repo/semantics/publishedVersion
Link to the original source: https://www.mdpi.com/2076-3417/10/15/5197
Papper original source: Applied Sciences-Basel. 10 (15): 5197-
APA: Azam SA; Fragoso A (2020). Experimental and numerical simulation study of the vibration properties of thin copper films bonded to FR4 composite. Applied Sciences-Basel, 10(15), 5197-. DOI: 10.3390/app10155197
Licence document URL: https://repositori.urv.cat/ca/proteccio-de-dades/
Article's DOI: 10.3390/app10155197
Entity: Universitat Rovira i Virgili
Journal publication year: 2020
Publication Type: Journal Publications